1. The large amount of moisture contained in the air will cause the solder wire (
tin wire) or circuit boards, welding tools and other items to be damp. During the manual soldering process of the solder wire, the solvent in the flux will volatilize, causing the board surface to cool down, and the air in contact with it will be condensed to form a mist that condenses on the board surface. If the humidity is too high, if the board surface does not have a suitable angle for the vapor to diffuse, the solder will be pushed sharply, which will easily cause the tin explosion, which will cause intermittent tin explosion or solder joints and other undesirable phenomena.
2. The temperature of the soldering iron used for soldering the solder wire (tin wire) is also a very critical factor. The temperature of the soldering iron should be kept at a temperature suitable for solder wire soldering. Too high or too low may cause virtual Soldering, tin dissatisfaction, short circuit and other undesirable phenomena. In humid weather, the temperature of the soldering iron tip will become difficult to control. During continuous soldering, the temperature of the soldering iron tip may decrease due to the moisture in the air, causing soldering problems.
3. In addition to the solder wire and plate, wet weather also has a lot of influence on the solder joints. Due to the low temperature of the welding environment, the cooling speed of the solder joints will become faster, and the technical requirements for the welding operators will become higher. For people who are not proficient in welding, the probability of making mistakes becomes greater.
In summary, wet weather has a great influence on solder wire. We must pay more attention to soldering operations in this weather, and try to choose a dry environment for soldering.
The scope of use of solder wire and solder bar
Proper use of solder wire
What causes a lot of tin slag when using solder bar?
