The basic reason for the phenomenon of flower spots and residues on the surface of the
tin bar is that these trace alloy elements in the tin bar have a great influence on the physical and mechanical properties of the tin bar. If the amount is too large, the fatigue life and plasticity of the solder joint will be reduced, and the appropriate amount of bismuth is about 0.2~1.5%. In the systematically designed chemical composition, the designer obviously hopes that the performance of the tin bar can reach an optimal balance, such as welding performance, melting temperature, strength, plasticity and fatigue life.
The above problems are determined by the relationship between the manufacturing process and the mold. The cause of blistering is related to the weather during manufacture. For example, our factory has been paying attention to these situations and looking for better solutions. Usually, when holding the tin bar, do not touch it directly with your hands, because the moisture in your hand will affect the brightness of the tin bar. When the tin bar is stored for a long time or the storage place is too humid, there will be a layer of oxide on the surface, which will also reduce the brightness of the tin bar, but it has no effect on the use effect.
The tin bar adopts high-purity refined tin and advanced smelting process, unique anti-oxidation alloy formula, its slag is very small, the solder joint is bright and reliable, and its wettability is good. It is suitable for lead-free wave solder and hot dip soldering. The raw materials used are 100% electrolytic tin, lead or tin-lead alloys, which are then molded or extruded. This results in stable high purity, ultra-low slag and high wettability, making it suitable for a variety of welding processes. Due to the strict selection of raw materials and its unique casting or extrusion forming process, it is suitable for electronic products with extremely high reliability requirements.
The scope of use of solder wire and solder bar
Proper use of solder wire
What causes a lot of tin slag when using solder bar?
