The high temperature anti-oxidation solder bar
is specially manufactured for electronic manufacturers whose solder furnace temperature is 400°C-500°C. Provide building templates for electronic components containing enameled wires, and tinning for coolers (such as transformers, inductors, coils, relays, degaussing coils, etc.).
High temperature anti-oxidation solder bar has the following advantages:
1. The liquid surface is bright when the soldering furnace operates at high temperature, and there is no need to scrape the tin slag on the soldering surface every time the operation is performed. The workability is good, the production efficiency is high, and the output is increased;
2. The components are easy to be tinned and the bottom plate hardly adheres to the tin slag;
3. After tinning, the surface of the pins is bright, smooth and good in appearance;
4. Less tin slag can reduce material cost.
Compared with ordinary solder bars, when ordinary tin bars work at temperatures above 400 °C, yellow or brown oxides will be produced on the liquid surface of the tin furnace in a short period of time. After tinning, the slag adheres to the bottom plate and needs to be manually brushed off, which results in poor workability, low production efficiency and waste of solder.