The management and adjustment of the wave soldering furnace during the welding process of the
wave soldering bar is very important. If the operation is improper, there will be a lot of solder residue and the board will be dirty. :
a. The solid content of the flux is high, and there are too many non-volatile substances; during the use of the flux, no diluent is added for a long time; the flux is coated too much.
b. No preheating before welding or the preheating temperature is too low (dip welding, the time is too short).
c. The board running speed is too fast (the flux is not fully volatilized).
d. The temperature of the tin furnace is not enough, there are too many impurities in the furnace or the degree of the tin bar is low.
e. It is caused by adding antioxidant or antioxidant oil.
f. There are too many sticks or open components on the PCB, and there is no preheating.
h. The component foot and the board hole are disproportionate (the hole is too large) so that the flux rises.
i. The PCB itself has pre-coated rosin.
j. In the tinning process, the wettability of the flux is too strong.
k. PCB process problems, too few vias, resulting in poor flux volatilization.
l. The angle of the PCB entering the tin liquid is wrong when hand dipping.
In summary, attention must be paid to the welding operation of the wave solder bar to prevent the occurrence of poor solder, which will affect the production efficiency and product quality.
The scope of use of solder wire and solder bar
Proper use of solder wire
What causes a lot of tin slag when using solder bar?
