The production of solder paste will be designed according to different operating temperatures. We all know that the melting point of pure metal tin is about 230 ℃, and the melting point of alloy is that the mixture of two or more metals will be lower than the melting point of single metal. According to the type of two metal alloys and their content in the alloy, their melting points are also different. The internal solder powder is composed of different alloys. These alloys can be made into different types of solder pastes, and their melting points and melting temperatures will also be very different. Depending on the temperature required for the circuit board to be soldered, the solder powder alloy used is also different. For example, for the soldering of circuit boards or electronic components that are afraid of high-temperature baking, it is necessary to use solder pastes with relatively low melting points and relatively high reliability. For example, the die-bonding solder paste needs a solder paste with a relatively low melting point, so that the damage to the chip during die-bonding is relatively small. The requirements for the bracket during die bonding are relatively low, and it is possible that the solder has already melted during ball bonding, so it should be selected according to the actual situation. In some special cases, it is necessary to use low temperature welding, such as when welding copper pipes such as heating pipes, cooling pipes, condenser pipes, etc. You can use low temperature solder paste. What are the differences between low temperature solder paste and high temperature solder paste besides the difference in temperature? Today, Xinfujin solder paste manufacturer will announce the definition of high temperature solder paste for everyone.

1. Definition of high temperature solder paste: temperature

        Before lead-free solder was invented, solder paste containing tin-lead alloys was widely used in the whole solder industry. At a temperature of 183 °C, eutectic solder was directly converted from solid to liquid, and after cooling, it was converted from liquid to solid , It does not need to go through the state of solid-liquid coexistence, so during welding, even if the two welded materials are moved by vibration, the process of solder solidification will be relatively short, and the situation of poor welding of the solder joints caused by vibration or movement is relatively small.